8 research outputs found
Modelling and simulation of paradigms for printed circuit board assembly to support the UK's competency in high reliability electronics
The fundamental requirement of the research reported within this thesis is the provision
of physical models to enable model based simulation of mainstream printed circuit
assembly (PCA) process discrete events for use within to-be-developed (or under
development) software tools which codify cause & effects knowledge for use in product
and process design optimisation. To support a national competitive advantage in high
reliability electronics UK based producers of aircraft electronic subsystems require
advanced simulation tools which offer model based guidance. In turn, maximization of
manufacturability and minimization of uncontrolled rework must therefore enhance inservice
sustainability for ‘power-by-the-hour’ commercial aircraft operation business
models. [Continues.
Complex low volume electronics simulation tool to improve yield and reliability
Assembly of Printed Circuit Boards (PCB) in low volumes
and a high-mix requires a level of manual intervention during
product manufacture, which leads to poor first time yield and
increased production costs. Failures at the component-level
and failures that stem from non-component causes (i.e.
system-level), such as defects in design and manufacturing,
can account for this poor yield. These factors have not been
incorporated in prediction models due to the fact that systemfailure
causes are not driven by well-characterised
deterministic processes. A simulation and analysis support
tool being developed that is based on a suite of interacting
modular components with well defined functionalities and
interfaces is presented in this paper. The CLOVES (Complex
Low Volume Electronics Simulation) tool enables the
characterisation and dynamic simulation of complete design;
manufacturing and business processes (throughout the entire
product life cycle) in terms of their propensity to create
defects that could cause product failure. Details of this system
and how it is being developed to fulfill changing business
needs is presented in this paper. Using historical data and
knowledge of previous printed circuit assemblies (PCA)
design specifications and manufacturing experiences, defect
and yield results can be effectively stored and re-applied for
future problem solving. For example, past PCA design
specifications can be used at design stage to amend designs or
define process options to optimise the product yield and
service reliability
Characterization of printed solder paste excess and bridge related defects
Surface Mount Technology (SMT) involves the
printing of solder paste on to printed circuit board (PCB)
interconnection pads prior to component placement and
reflow soldering. This paper focuses on the solder paste
deposition process. With an approximated cause ratio of
50 – 70% of post assembly defects, solder paste
deposition represents the most significant cause initiator
of the three sub-processes. Paradigmatic cause models,
and associated design rules and effects data are
extrapolated from academic and industrial literature and
formulated into physical models that identify and
integrate the process into three discrete solder paste
deposition events - i.e. (i) stencil / PCB alignment, (ii)
print stroke / aperture filling and (iii) stencil separation /
paste transfer. The project’s industrial partners are
producers of safety-critical products and have recognised
the in-service reliability benefits of electro-mechanical
interface elimination when multiple smaller circuit
designs are assimilated into one larger Printed Circuit
Assembly (PCA). However, increased solder paste
deposition related defect rates have been reported with
larger PCAs and therefore, print process physical models
need to account for size related phenomena
A simulation module for supporting the manufacture of high value added electronics manufacturing
Given the global pressures and demanding
requirements for high value added electronics
manufacturing, it is vital to make the right decisions on
the shop floor. One of the main shop floor level decisions
in the domain is the selection of the most appropriate
scheduling strategy for the available manufacturing
system. Simulation has proved to be a powerful decision
support tool. However, very few studies have used this
potential to support the evaluation of scheduling
strategies in a manufacturing context. A component-based
simulation tool to evaluate the performance of scheduling
strategies on a particular system is presented in this paper.
The component based structure of the simulation tool
allows the main problem requirements to be addressed.
An example, based on a real company, illustrates the
nature of the simulation results and the kind of support
that can be obtaine
Complex Low Volume Electronics Simulation Tool to Improve Yield and Reliability
Assembly of Printed Circuit Boards (PCB) in low volumes
and a high-mix requires a level of manual intervention during
product manufacture, which leads to poor first time yield and
increased production costs. Failures at the component-level
and failures that stem from non-component causes (i.e.
system-level), such as defects in design and manufacturing,
can account for this poor yield. These factors have not been
incorporated in prediction models due to the fact that systemfailure
causes are not driven by well-characterised
deterministic processes. A simulation and analysis support
tool being developed that is based on a suite of interacting
modular components with well defined functionalities and
interfaces is presented in this paper. The CLOVES (Complex
Low Volume Electronics Simulation) tool enables the
characterisation and dynamic simulation of complete design;
manufacturing and business processes (throughout the entire
product life cycle) in terms of their propensity to create
defects that could cause product failure. Details of this system
and how it is being developed to fulfill changing business
needs is presented in this paper. Using historical data and
knowledge of previous printed circuit assemblies (PCA)
design specifications and manufacturing experiences, defect
and yield results can be effectively stored and re-applied for
future problem solving. For example, past PCA design
specifications can be used at design stage to amend designs or
define process options to optimise the product yield and
service reliability
A simulation module for supporting the manufacture of high value added electronics manufacturing
Given the global pressures and demanding
requirements for high value added electronics
manufacturing, it is vital to make the right decisions on
the shop floor. One of the main shop floor level decisions
in the domain is the selection of the most appropriate
scheduling strategy for the available manufacturing
system. Simulation has proved to be a powerful decision
support tool. However, very few studies have used this
potential to support the evaluation of scheduling
strategies in a manufacturing context. A component-based
simulation tool to evaluate the performance of scheduling
strategies on a particular system is presented in this paper.
The component based structure of the simulation tool
allows the main problem requirements to be addressed.
An example, based on a real company, illustrates the
nature of the simulation results and the kind of support
that can be obtaine
Characterization of printed solder paste excess and bridge related defects
Surface Mount Technology (SMT) involves the
printing of solder paste on to printed circuit board (PCB)
interconnection pads prior to component placement and
reflow soldering. This paper focuses on the solder paste
deposition process. With an approximated cause ratio of
50 – 70% of post assembly defects, solder paste
deposition represents the most significant cause initiator
of the three sub-processes. Paradigmatic cause models,
and associated design rules and effects data are
extrapolated from academic and industrial literature and
formulated into physical models that identify and
integrate the process into three discrete solder paste
deposition events - i.e. (i) stencil / PCB alignment, (ii)
print stroke / aperture filling and (iii) stencil separation /
paste transfer. The project’s industrial partners are
producers of safety-critical products and have recognised
the in-service reliability benefits of electro-mechanical
interface elimination when multiple smaller circuit
designs are assimilated into one larger Printed Circuit
Assembly (PCA). However, increased solder paste
deposition related defect rates have been reported with
larger PCAs and therefore, print process physical models
need to account for size related phenomena
Current leakage failure of conformally coated electronic assemblies
Conformal coatings are widely used on circuit board
assemblies as an attempt to improve reliability and to
ensure high insulation impedances, which are for example
demanded by low current consumption battery operated
RF circuitry. However, components, such as small
ceramic capacitors, have occasionally been found to fail
in some applications, particularly when covered with a
thick silicone conformal coating. This is thought to be
due to the diffusion of water through the coating to the
capacitor surface where it then combines with solder flux
residue, or other organic or ionic contamination left on
the components, thereby dramatically increasing the
effective component leakage current. The primary
objective of this experimental research is therefore to
establish a clear understanding of the effects of moisture
exposure on the surface insulation resistance (SIR) of
conformally coated printed circuit board (PCB)
assemblies. This has been achieved through leakage
current measurements on multilayer ceramic capacitors
during storage in an environmental chamber during
testing similar to IPC standards for non-component
loaded boards